Electronics Forum | Tue Sep 14 13:49:14 EDT 1999 | Earl Moon
| I am looking to find a formula to calculate the resistance of circuit traces based on width | The old MIL-STD-275 became IPC-STD-275 became IPC-2221/2222. Anyway, they had/have simple graphic representations converting AWG standards into equivalen
Electronics Forum | Wed Jul 06 13:22:25 EDT 2005 | Dreamsniper
Can anyone help me on where to find reference for the above info other than IPC2221 as it is not covered by the said standard. I am looking for a proper trace spacing for my lightning protection circuit on my PCB for the following requirements: 750
Electronics Forum | Wed Jul 06 13:22:48 EDT 2005 | Dreamsniper
Can anyone help me on where to find reference for the above info other than IPC2221 as it is not covered by the said standard. I am looking for a proper trace spacing for my lightning protection circuit on my PCB for the following requirements: 750
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Thu Dec 05 02:15:12 EST 2019 | sssamw
IPC 2221B mentions a minimum clearance of 0.5 mm between adjacent holes. A drill-to-drill spacing of 20 mils is a standard value in manufacturer design rules. For small annular rings and pad-to-pad clearance, the minimum via distance is often defin
Electronics Forum | Mon Jul 10 20:59:14 EDT 2006 | davef
Dave Try: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards Our old [euphemistically] friend Earl Moon has written extensively on DFM. Look at his site: http://
Electronics Forum | Tue May 29 20:22:19 EDT 2001 | davef
Well, no fault with your calculations from here. They appear to be correct. [Logic doesn't appear to be off to far off base, either. An epiphany, eh?] As mentioned in an earlier posting on this thread, consider following the recommendations of IP
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef
IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
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