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Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

What is Underfill

Technical Library | 2024-03-19 15:53:34.0

Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.

GPD Global

Cost Effective Solution for Conformal Coating

Cost Effective Solution for Conformal Coating

Videos

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

Selective Conformal Coating Systems - Tilt and Rotate

Selective Conformal Coating Systems - Tilt and Rotate

New Equipment | Coating Equipment

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

Watch this conformal coating demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system.

Watch this conformal coating demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system.

Videos

http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr

GPD Global

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

GPD Global to Promote PCD Dispensing at the SMTA Dallas Expo & Tech Forum

Industry News | 2011-02-04 01:47:14.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.

GPD Global

See GPD Global's PCD Dispensing in Action at the SMTA Houston Expo & Tech Forum

Industry News | 2011-02-07 15:23:56.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

GPD Global

See GPD Global's PCD Technology at IMAPS Device Packaging 2011

Industry News | 2011-02-17 15:04:54.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.

GPD Global

GPD Global to Exhibit PCD 'H' Series at Assembly & Automation Technology Expo 2011

Industry News | 2011-08-22 15:44:33.0

GPD Global will debut its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #1849 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL.

GPD Global

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ipc4101/126 pcb materials searches for Companies, Equipment, Machines, Suppliers & Information

Precision PCB Services, Inc
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