Electronics Forum | Mon Feb 20 04:59:40 EST 2006 | Loco
For visual inspection table 1-2 seems to be in order here. If you can not see the bottom using 1.8 and table 1-2, it clearly would be a defect and rework would be the only option Well, my thoughts anyway, wonder if someone has other thoughts on thi
Electronics Forum | Sat Feb 18 15:40:45 EST 2006 | Cmiller
Switch to SN100C (no pun intended). I cant help with the SAC 305 issues but we should have a wave with SN100 running very soon. I will let you all know how that goes. Please report back on the x-sectioning and share the results. I have heard some v
Electronics Forum | Wed May 09 13:37:07 EDT 2007 | jmills
Greetings Tried to search past threads without an answer. I have a resistor that just fits the between pads. Some of the resisitor were installed without the termnation sitting on the pad and are infact sitting on solder a good .020 to .025 above th
Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol
Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel
Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
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