New Equipment | Assembly Services
Taiyo Yuden New and Original EMK105BJ105KV-F in Stock IC SMD , 21+ package EMK105BJ105KV-F Multilayer Ceramic Capacitors (High Dielectric Constant) Today's Hot Deals： NCV317MABDTRKG TO-252 ON 21+ IC16F1934-I/PT TQFP64 MICROCHIP 17+ SPUD-0
TI New and Original OPA4376AIPWR in Stock TSSOP14 package TI New and Original OPA4376AIPWR in Stock TSSOP14 package TI New and Original OPA4376AIPWR in Stock TSSOP14 package 74HC245D NXP 74HC1G14GW NXP 74HC165D NXP 74HC164D NXP 74HC14D NXP
Industry News | 2015-06-01 12:17:17.0
NEPCON China 2015 took place at the Shanghai Expo Center from 21 to 23 April 2015. The three-day event, an annual industry highlight, was a complete success, bringing together nearly 22,000 trade visitors and high quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide.
New Equipment | Assembly Services
ST New and Original BAT46ZFILM in Stock IC SOD-123 22+ package BAT46ZFILM Small Signal Schottky Diode NCV7720DQAR2G SSOP24 ON 22+ NUP2105LT1G SOT23 ON 22+ IS42S16400J-6TLI TSOP54 ISSI 22+ DG409DQ-T1-E3 TSSOP16 VISHAY 21+ FDD6637 TO-252 ON 22+
New Equipment | Assembly Services
NXP New and Original MMPF0100NPAEP in Stock IC QFN56 22+ package MMPF0100NPAEP Power Management IC, i.MX6, no-prog ,4/6 buck, 6 LDO, 1 boost, QFN 56 NCV7720DQAR2G SSOP24 ON 22+ NUP2105LT1G SOT23 ON 22+ IS42S16400J-6TLI TSOP54 ISSI 22+ DG409DQ-
New Equipment | Assembly Services
TI New and Original MSP430FR2676TPTR in Stock IC LQFP-48 22+ package MSP430FR2676TPTR Capacitive Touch MCU with 16 Touch IOs (64 Sensors), 64KB FRAM, 8KB SRAM, 43 IOs, 12-bit ADC, 105C NCV7720DQAR2G SSOP24 ON 22+ NUP2105LT1G SOT23 ON 22+ IS42S
New Equipment | Assembly Services
TI New and Original SN65DSI84TPAPRQ1 in Stock IC HTQFP-64 22+ package SN65DSI84TPAPRQ1 MIPI® DSI Bridge to FlatLink™ LVDS Single Channel DSI to Dual Link LVDS Bridge NCV7720DQAR2G SSOP24 ON 22+ NUP2105LT1G SOT23 ON 22+ IS42S16400J-6TLI TSOP54 I
Industry News | 2015-03-31 19:03:44.0
The electronics manufacturing automation trend, as seen in robotics, motion control, automation equipment/accessories, transmission, tools, assembly and materials, is a key industry highlight, transforming electronics manufacturing by encouraging ongoing restructuring. NEPCON China 2014 introduced new equipment and technologies in its EMA zone, demonstrating how, robotics are replacing manual labor. This year, at the Shanghai Expo Center, NEPCON China 2015 will again focus on electronics manufacturing automation, while highlighting automation system integration, a step beyond mere hardware equipment.
INFINEON New and Original IPT015N10N5ATMA1 in Stock HSOF-8 package INFINEON New and Original IPT015N10N5ATMA1 in Stock HSOF-8 package INFINEON New and Original IPT015N10N5ATMA1 in Stock HSOF-8 package VNS3NV04DPTR-E ST 2N7002 ON TL431 ON TIP1
New Equipment | Assembly Services
TI New and Original TPS62813QWRWYRQ1 in Stock IC VQFN-9 , 22+ package TPS62813QWRWYRQ1 Automotive 2.75V to 6V, 3A Buck Converter with Fixed Fsw and SYNC in 2mm x 3mm Wettable Side Today's Hot Deals： SI3050-E1-FTR TSSOP20 SILICON 21+ ET1100
