Electronics Forum | Tue Jun 09 18:44:20 EDT 2009 | dyoungquist
We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. Is there a standard that specifies how long the assemblies need to be baked/dried after being submersed in a water solution for a
Electronics Forum | Fri Sep 07 15:19:42 EDT 2001 | davef
Watt tiepoo? [Cereally, you can usually fix typos after you post by using the P yellow �edit� button that shows when you are looking at your posting.] We�re had people on SMTnet that were washing their boards with a brush attached to the end of a ga
Electronics Forum | Tue Dec 09 10:04:36 EST 2008 | lazzara55
SMT-ypw: Does PWB supplier start to implement PWB drying packaging? B3: YES! The fabrication of the PCB involves a series of wet processing that requires counter-measures to remove moisure. While some of the PCB processes also include bake cycles th
Electronics Forum | Tue Jul 31 20:05:11 EDT 2001 | davef
There is no the industry standard specification for resisitivity monitoring at aqueous cleaning. Beyond those posted here earlier by Mikie, guidelines can be found in the fine SMTnet Archives, for instance: (http://www.smtnet.com/Forums/Index.cfm?CF
Electronics Forum | Mon Feb 19 14:17:21 EST 2001 | bschreiber
Hi Mark, If you are a user of stencils, you already know that there are literally hundreds of stencil manufacturers out there. If you found one that will allow such hot temperatures, I would be interested in learning who it is. However, I have only
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran
DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48
Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
