Full Site - : isola (Page 9 of 10)

FR4 or CEM3

Electronics Forum | Tue Jun 22 00:09:14 EDT 2010 | leadthree

You should do some testing what temp you really get. Solder will melt 260~300ºC. Back to the initial question, CEM-3 is a bit harder to buy and has not many varieties. Go for FR4, you can go for a higher Tg then the common 130ºC. There is also 140,

Changing Ni/Au finish to HASL lead free

Electronics Forum | Thu Jan 06 17:33:07 EST 2011 | boardhouse

Hi Johan, Sounds like you have already gone over your product very well to reduce product cost. Switching away from Deep gold Tabs & carbon ink Key pads can save quite a bit. The only other thing to suggest would be material - Moving away from Isol

rigid-Flex board via problems

Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef

Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1

High TG?

Electronics Forum | Wed Nov 15 09:36:27 EST 2006 | Board House

Hi AJ, The biggest mistake in the industry today is documentation for lead free assembly required product. We are still seeing prints coming in saying Lead Free / High TG FR4. When in reality standard FR4 170 Tg. material is considered High Tg. and L

Delamination on IS410 laminate

Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110

I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with

Delamination / Measling

Electronics Forum | Sat Dec 13 17:46:27 EST 2008 | ysutariya

If you're military then you're probably just needing standard 130Tg FR4 and tin-lead finish. I would check two things: 1. Bake temperature: Isola recommends 300F for 4 hours to drive moisture out. Lower baking temperatures do not require a linea

Does pot temperature affects quality of the solder joints?

Electronics Forum | Mon Feb 06 17:19:59 EST 2017 | davef

Evtimov: IDEALS Project was one of the first to talk about componebt and board damage caused by LF soldering temperatures. There's lots of more current stuff on the web. Here's some that may help: * Assessment of Long-term Reliability in Lead-free As

Why can my bare PCB be magnetized?

Electronics Forum | Mon Jan 29 12:09:55 EST 2018 | fluxgate

I am working on a magnetic sensors design and noticed that my measured magnetic field bias shifts over time. I have studied the bare PCB and measured that it can be magnetized with a strong magnet. I tested two blank (unpopulated PCBS). The first PC

Re: Buried Capacitance In PWB

Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon

| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I

delamination test

Electronics Forum | Thu Sep 01 18:53:08 EDT 2005 | Board House

Pr. I agree with some of the above responses. if you are seeing Delam issues with incoming PCB's the following should be check. 1) Check the OEM Print to what Material they are calling out to be manufactured with. 2) If they are calling out for S


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