FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
Used SMT Equipment | In-Circuit Testers
Agilent E5515C 8960 Series 10 Wireless Communications Test Set The industry standard for high-speed, accurate and reliable RF measurements, coupled with flexible network emulation The Agilent E5515C hardware platform for the 8960 wireless com
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-002-003-E1962B-E1968A-201 8960 Series 10 Wireless Communications Test Set The industry standard for high-speed, accurate and reliable RF measurements, coupled with flexible network emulation The Agilent E5515C hardware platform
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2013-07-22 17:01:59.0
Isola Group S.a.r.l. announced today its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
SMTnet Express, June 29, 2017, Subscribers: 30,527, Companies: 10,624, Users: 23,443 Round Robin of High Frequency Test Methods by IPC-D24C Task Group Glenn Oliver, Jonathan Weldon - DuPont , Chudy Nwachukwu - Isola, John Coonrod - Rogers
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. These voids are the result of assembly process issues and do not have material or design root causes. Macro voids are due to assembly variation that can be eliminated with matched material and consistent process parameter selection/control
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