Used SMT Equipment | Soldering - Reflow
Vitronics Isotherm 500S 1997 Surface Mount Technology Equipment reflow oven Easy Set-up and operation Five (5) top heat zones w/ mesh belt/ edge rail conveyor, 12” process length, 64” heated tunnel length, 12” x 20” max PCB board size PC and monitor
Used SMT Equipment | Soldering - Reflow
Vitronics Isotherm 500S 1997 Surface Mount Technology Equipment reflow oven Easy Set-up and operation Five (5) top heat zones w/ mesh belt/ edge rail conveyor, 12” process length, 64” heated tunnel length, 12” x 20” max PCB board size PC and monito
Percent to ppb level of impurity detection; single or dual detector; isothermal or temperature programmable; educational, laboratory or industrial applications; TCD, DID, FPD, PIP or FID detectors; corrosive & non-corrosive gas applications
Used SMT Equipment | Soldering - Wave
Electrovert VectraElite Pb Free Wave Soldering Machine * 480VAC 3 phase power and dry shop air required for operation. * DOM - 09/2007 * Windows O/S * Electrovert ServoJet spray fluxer * Conveyor L to R process flow, rigid intermix V and L finge
Used SMT Equipment | Soldering - Wave
Electrovert VectraElite Pb Free Wave Soldering Machine * 480VAC 3 phase power and dry shop air required for operation. * DOM - 09/2007 * Windows O/S * Electrovert ServoJet spray fluxer * Conveyor L to R process flow, rigid intermix V and L finge
Service and support of Vitronics Soltec US factory made reflow ovens. 20+ years of experience supporting these products as a former employee.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
