Electronics Forum | Wed Dec 11 06:47:33 EST 2019 | ameenullakhan
Dear Friends, Need your valuable feedback on how to identify the component is ok or not for manufacturing. Issue : We have parts which are more than 5 years old.And management want us to qualify this parts for production. We presently use below me
Electronics Forum | Thu Mar 23 22:20:51 EST 2000 | Dave F
Chris: I'm unsure about the kits you seek. Solderability of: * Components: J-STD-002, Dip And Look Method. Malcom Instruments makes a very nice tester. * Boards: IPC TM-650 2.4.12A Solderability, Edge Dip Method Good luck Dave F
Electronics Forum | Sat Mar 03 23:24:55 EST 2001 | CAL
We test Parts and Components to IPC J-std-002/003. We also use a wetting Balance tester to determine solderability. We also test with SERA. We use ROSA to electrochemically revert the components back to their original state. Need more info ... email
Electronics Forum | Wed Feb 16 17:28:14 EST 2005 | davef
Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another 0805 lead does not solder On the 0805 lead does not solder, there does the solder go? * On the pad * On the component lead A common solderability test
Electronics Forum | Mon Jan 09 15:49:50 EST 2006 | GS
You can find some good idea by reading IPC-J-STD-002B (or later review ) Solderability test and also the JEDEC Standard (free down load) JESD22-B102D solderability test. A suggestion, first of all check how old are the chips (read data Code on Label
Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef
We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M
Electronics Forum | Tue May 06 21:24:28 EDT 2014 | davef
Most ceramic you'll see comes from Coors or Kyocera. Size of your substrate will vary according to the stencil / component that you're using. 3" by 3" should be sufficient for most applications. If you get them too small, you could have handling is
Electronics Forum | Tue Dec 15 15:21:17 EST 2015 | davef
Peculiar that ENIG boards are corroded, not that it can't happen. * J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * J-STD-003, Solderability Tests for Printed Boards The first person I'd talk with is my
Electronics Forum | Tue Jun 26 19:59:08 EDT 2001 | davef
They always tell you to calculate ROI, when they want to blow you off. Do a net search using - calculate ROI. Links to three pretty good descriptions on this are: http://www.dmreview.com/editorial/dmreview/print_action.cfm?EdID=2487 http://www.eval
Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
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