New Equipment | Test Equipment
MUST System III – Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401. Includes everything needed for all forms of solderability t
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
Electronics Forum | Wed Dec 11 06:47:33 EST 2019 | ameenullakhan
Dear Friends, Need your valuable feedback on how to identify the component is ok or not for manufacturing. Issue : We have parts which are more than 5 years old.And management want us to qualify this parts for production. We presently use below me
Electronics Forum | Mon Jan 09 15:49:50 EST 2006 | GS
You can find some good idea by reading IPC-J-STD-002B (or later review ) Solderability test and also the JEDEC Standard (free down load) JESD22-B102D solderability test. A suggestion, first of all check how old are the chips (read data Code on Label
Electronics Forum | Tue Mar 04 09:12:35 EST 2008 | davef
Q1. What would you recommend for the best practice or comparison? A1. We'd go with dip & look. It's easy and cheap, requires no advanced degrees in measurology. Have you reviewed "J-STD-002B - Solderability Tests for Component Leads, Terminations, Lu
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr
.gif)
