New Equipment | Solder Materials
To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporati
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Mon Oct 21 13:40:05 EDT 2002 | slthomas
Is it safe to use the 100M ohm value found in Table 2 of J-STD-004 as a minimum for SIR with respect to flux specification acceptability? It (J4) appears to imply that that value provides some level of acceptability, but it just doesn't come right o
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2021-03-12 04:52:58.0
MacDermid Alpha Electronics Solutions announces the release of ALPHA OM-220, its latest innovation in low-temperature solder technology.
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world
SMTnet Express, July 13, 2017, Subscribers: 30,584, Companies: 10,624, Users: 23,496 Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements K. Tellefsen, M. Holtzer, T. Cucu, M. Liberatore, M. Schmidt - Alpha
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/about-us/standards/ipc-j
forraszthatósági vizsgálata J-STD-004 – Forrasztási folyasztóanyagok általános követelményei és vizsgálati módszerei J-STD-005 – Forrasztókenőcsök általános követelményei és vizsgálati módszerei J-STD-006 – Elektronikai
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
