Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Industry News | 2013-01-16 13:59:39.0
Seika Machinery, Inc., will showcase its proven, advanced machinery in booth #2727 at the upcoming IPC APEX EXPO
Industry News | 2014-02-19 16:39:50.0
Seika Machinery, Inc.announces that it will exhibit in Booth #2433 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2017-08-15 21:13:12.0
Seika Machinery today announced plans to exhibit in Booth #715 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Seika will showcase a complete line up of leading-edge equipment, including the McDry DXU-401DP Pass Through Dry Cabinet, SAYAKA CT23NQ PCB Router, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM RCX Series and PCU-02V Spiral Viscometer. All equipment purchased on the show floor will receive special show pricing.
New Equipment | Board Handling - Storage
Eureka TUS-1001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-1001 Model: TUS-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing
Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Wed Jul 17 06:54:17 EDT 2013 | deanm
We manufacture according to military Class 3 standards and we do not vacuum seal any MSD devices. Your current method of dry packing is sufficient as well as dry cabinet or nitrogen storage. A light evacuation of air during the dry packing process
Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1
I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
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