Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2019-09-19 00:28:48.0
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a 'ping pong' conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible. This paper will focus on the chemical characteristics and use them to predict or identify potential issues before they occur rather than specifically name 'critical' soldermasks. It is also the intention of this paper to address the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. It is hoped that this awareness will help fabricators to ensure maximum yields by asking the right questions. 'Critical’ soldermasks impact all selective finishes. In this paper, practical experience using immersion tin will be used to highlight the relationship between 'critical' soldermasks and some of the issues seen in the field. The paper will include a novel approach to identify re-deposited volatiles after the reflow.
Industry News | 2016-12-18 14:30:00.0
EPE Corporation has purchased the Nordson ASYMTEK Spectrum™ S-920 Automated Fluid Dispense System.
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
New Equipment | Wave Soldering
Ersa ECOSELECT 1 Selective Soldering System PCB:424 x 508 mm PCB weight: 8 kg Mini-wave 13 kg up to 2 pots Electromagnetic solder pot Product description: Ersa ECOSELECT 1 Selective Soldering System, PCB:424 x 508 mm, PCB weight: 8 kg, Mini-wa
New Equipment | Solder Materials
Solder Testing from $79 to $149 If you have a wave solder machine, a solder dip pot, or selective soldering system then you should consider the consequences of not monitoring your solder pot. An informal 20 year survey of the electronics manufactur
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
New Equipment | Wave Soldering
Selective Soldering System Ersa ECOSELECT 1 PCB width: 15-406 mm top side clearance: 120 mm PCB weight: 8 kg Mini-wave 13 kg up to 2 pots Product description: Selective Soldering System Ersa ECOSELECT 1, PCB width: 15-406 mm, top side clearanc
New Equipment | Wave Soldering
Selective Soldering System Ersa ECOSELECT 1 PCB width: 15-406 mm top side clearance: 120 mm PCB weight: 8 kg Mini-wave 13 kg up to 2 pots Product description: Selective Soldering System Ersa ECOSELECT 1, PCB width: 15-406 mm, top side clearanc
