Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
New Equipment | Wave Soldering
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New Equipment | Selective Soldering
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New Equipment | Wave Soldering
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New Equipment | Wave Soldering
Ersa ECOSELECT 1 Selective Soldering System PCB:424 x 508 mm PCB weight: 8 kg Mini-wave 13 kg up to 2 pots Electromagnetic solder pot Product description: Ersa ECOSELECT 1 Selective Soldering System, PCB:424 x 508 mm, PCB weight: 8 kg, Mini-wa
New Equipment | Education/Training
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70 percent of SMT manufacturing defects are caused at the solder paste printing process. Detection of these printing defects can greatly increase the overall quality of finished products and decrease the human hours associated with post-process repai
Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
70 percent of SMT manufacturing defects are caused during the solder paste printing process. Detection of these printing defects can greatly increase the overall quality of finished products and decrease the human hours associated with post-process r
Technical Library | 2019-03-06 21:26:14.0
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints
