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Zortrax

Industry Directory | Other

Zortrax is a manufacturer of integrated 3D printing environment: 3D printer, materials and software. Zortrax is providing its solution to SMB market and industries such as robotics, automation, architecture, engineering and more.

Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards

Technical Library | 2018-11-07 20:48:01.0

Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications. We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously.

Electro Scientific Industries

Vitronics mySelective 6745

Vitronics mySelective 6745

Used SMT Equipment | Soldering Equipment/Fluxes

Vitronics Soltec mySelective 6745 IBE SMT Inventory ID : 101012-001 Vitronics Soltec Serial Number : MS45.0022 Vintage : JAN 2009 Details Two Pots: (1) 63/37 PB (1) SN100C PB-Free Includes Onsite Gas N-30 Nitrogen Generator

IBE SMT Equipment

Precision Valve & Automation (PVA) Delta 6 Coating System

Precision Valve & Automation (PVA) Delta 6 Coating System

Used SMT Equipment | Coating and Encapsulation

PVA Delta 6 Coating System IBE SMT Inventory ID : 190114-001 PVA Serial Number : W6086 Vintage : JAN 2015 Details •w/ FCS300-ES-M Atomized Spray Valve •w/ (2) FC100-MC Front Closing Valves •4th Axis Upgrade •Fiducial Recognition •Interna

IBE SMT Equipment

Tyco Electronics To Report Fiscal First Quarter Results on Jan. 28, 2009

Industry News | 2009-01-13 20:08:09.0

PEMBROKE, Bermuda, Jan. 6 /PRNewswire-FirstCall/ Tyco Electronics Ltd. will report fiscal first quarter results before trading begins on Wednesday, Jan. 28, 2009. The company will hold a conference call for investors at 8:30 a.m. EST.

TE Connectivity

Zebra Technologies 110Xi4 Thermal Barcode Label Printer

Zebra Technologies 110Xi4 Thermal Barcode Label Printer

Used SMT Equipment | General Purpose Equipment

Zebra Xi Series 110Xi4 Thermal Barcode Label Printer GENERAL Manufacturer: Zebra Technologies Model: X1 Series 110Xi4 Printer Type:Label printer PRINTER Print Speed: Up to 840.9 inch/min - max speed Built-in Devices:peeler with liner rewind

Tekmart International Inc.

Zebra Technologies  Z4M Thermal Barcode Label Printer

Zebra Technologies Z4M Thermal Barcode Label Printer

Used SMT Equipment | Labeling Systems

Zebra Technologies Z4M Thermal Barcode Label Printer Manufacturer: Zebra Technologies Model: Z4M Printer Type: Label printer Camera installed size: 2 MB Power device Type: power supply Nominal Voltage: AC 120/230 V Frequency Required: 50/6

Tekmart International Inc.

Latent heat induced deformation of PCB substrate: Measurement and simulation

Technical Library | 2022-12-05 16:28:06.0

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Czech Technical University in Prague

Speedline VectraElite Automated Wave Soldering Machine

Speedline VectraElite Automated Wave Soldering Machine

Used SMT Equipment | Soldering - Wave

Speedline VectraElite Automated Wave Soldering Machine (2007) Brand: Speedline  Model: VectraElite Year: 2007 Serial #: VC2-15869 Type: Automated Wave Soldering Machine Machine Specifications: Voltage: 480V Solder used: SN63Pb37 Sono

Tekmart International Inc.

Tyco Electronics Sets Date For 2010 Annual General Meeting of Shareholders

Industry News | 2010-01-28 11:37:11.0

SCHAFFHAUSEN, Switzerland, Jan. 28 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL) today announced that its 2010 annual general meeting of shareholders (AGM) will be held on Wednesday, Mar. 10, 2010 at 2:00 p.m., Central European Time (8:00 a.m., Eastern Standard Time) at the Radisson Blu Hotel, Zurich Airport, Zurich, Switzerland.

TE Connectivity


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