Used SMT Equipment | Coating and Encapsulation
PVA Delta 6 Coating System IBE SMT Inventory ID : 190114-001 PVA Serial Number : W6086 Vintage : JAN 2015 Details •w/ FCS300-ES-M Atomized Spray Valve •w/ (2) FC100-MC Front Closing Valves •4th Axis Upgrade •Fiducial Recognition •Interna
Industry News | 2009-01-13 20:08:09.0
PEMBROKE, Bermuda, Jan. 6 /PRNewswire-FirstCall/ Tyco Electronics Ltd. will report fiscal first quarter results before trading begins on Wednesday, Jan. 28, 2009. The company will hold a conference call for investors at 8:30 a.m. EST.
Used SMT Equipment | General Purpose Equipment
Zebra Xi Series 110Xi4 Thermal Barcode Label Printer GENERAL Manufacturer: Zebra Technologies Model: X1 Series 110Xi4 Printer Type:Label printer PRINTER Print Speed: Up to 840.9 inch/min - max speed Built-in Devices:peeler with liner rewind
Used SMT Equipment | Labeling Systems
Zebra Technologies Z4M Thermal Barcode Label Printer Manufacturer: Zebra Technologies Model: Z4M Printer Type: Label printer Camera installed size: 2 MB Power device Type: power supply Nominal Voltage: AC 120/230 V Frequency Required: 50/6
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
Used SMT Equipment | Soldering - Wave
Speedline VectraElite Automated Wave Soldering Machine (2007) Brand: Speedline Model: VectraElite Year: 2007 Serial #: VC2-15869 Type: Automated Wave Soldering Machine Machine Specifications: Voltage: 480V Solder used: SN63Pb37 Sono
Industry News | 2019-12-04 14:17:56.0
After four days of hotly-contested competition on the Virtual Reality racing simulator at the Europlacer booth at this year’s Productronica exhibition, the top podium finish went to Jan Pokos, a Croatian student.
Industry News | 2010-01-28 11:37:11.0
SCHAFFHAUSEN, Switzerland, Jan. 28 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL) today announced that its 2010 annual general meeting of shareholders (AGM) will be held on Wednesday, Mar. 10, 2010 at 2:00 p.m., Central European Time (8:00 a.m., Eastern Standard Time) at the Radisson Blu Hotel, Zurich Airport, Zurich, Switzerland.
Industry News | 2003-02-20 08:47:58.0
Announced a net loss of $58,000 for Q3 2003, ending Jan. 31, 2003
Industry News | 2022-01-03 07:40:24.0
The Murray Percival Company is pleased to announce that with the return of IPC APEX, their sales force will be in attendance at the show and ready to meet with existing and potential customers. The show will be taking place in San Diego, CA at the San Diego Convention Center, from Monday, Jan 24-Thursday, Jan 27.
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