New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
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