New Equipment | Industrial Automation
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Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2008-10-13 18:04:29.0
Minneapolis, MN � Registration is now open and the program is finalized for the 14th Annual Pan Pacific Microelectronics Symposium & Exhibit taking place February 10 - 12, 2009 at the Hapuna Beach Prince Hotel on the Big Island of Hawaii. The conference promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smta-pan-pacific-symposium-2018
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Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
Pan Pac 2020 Program TIME LOCATION 12:00PM - 5:30PM Foyer 2:15PM - 2:55PM Lehua/Hau 2:55PM - 3:35PM Lehua/Hau 3:35PM- 3:50PM Courtyard 3:50PM - 4:25PM Lehua/Hau 4:25PM- 5:00PM Lehua/Hau 5:00PM - 6:00PM Breezeway TIME LOCATION Session 1 - Electrochemical Migration
