Electronics Forum | Mon Nov 08 14:18:10 EST 1999 | John Thorup
Reduced Oxide Soldering Activation is an electrochemical method of restoring the solderability of surfaces. Searching the archives of IPC technet and this forum will reveal more details. John Thorup
Electronics Forum | Mon May 15 14:59:27 EDT 2000 | John Thorup
Hello Aldo Can't help you with the virtues of a specific machine but I would suggest that you search this net's industry directory for a number of of other possibilities. Also try Microscan in Washington State. 360/331-8212 John Thorup
Industry News | 2003-03-26 08:43:33.0
Dr. Jeffrey Graves has been named President and Chief Executive Officer, effective immediately.
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2018-11-14 21:43:14.0
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.
Events Calendar | Tue Aug 29 00:00:00 EDT 2023 - Thu Aug 31 00:00:00 EDT 2023 | Irving, Texas USA
High-Reliability Cleaning and Conformal Coating Conference
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste
: Consider Halogen-Free Flux and Solder Paste Back to all posts Part 2 of 2 – The Need for Halogen-Free Materials and the Impact on Your Electronics Manufacturing Process By John Vivari What will happen if halogen-containing substances are banned from use in electronics manufacturing
Surface Mount Technology Association (SMTA) | https://www.smta.org/counterfeit/tech_committee.cfm
Symposium on Counterfeit Parts and Materials Menu + Home Call for Abstracts Technical Program 2020 Program Keynote Professional Development Courses Technical Committee Sponsorships and Exhibits Hotel/Travel Technical Committee Diganta Das, Ph.D
