Industry Directory | Manufacturer
For nearly 50 years, JW Speaker has produced quality custom lighting systems for vehicular markets, adding value for our customers thru speed, cost, and innovation.
Industry Directory | Consultant / Service Provider / Other
Ardent help companies to Find, Set up and , Manage their indeprndent sales organizations in the USA Providing a low cost solution to sales and sales management
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New Equipment | Industrial Automation
Contact 24/7 hours Skype : dddemi33 QQ :2851195473 Sales Manager : Tiffany Guan Email me：sales@askplc.com Mb(Whatsapp):+86 18030235313 Our Website: www.askplc.com Quick details 1)Quality is guarantee within 1 year from the date of
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New Equipment | Industrial Automation
Contact 24/7 hours Skype : dddemi33 QQ :2851195473 Sales Manager : Tiffany Guan Email me：sales@askplc.com Mb(Whatsapp):+86 18030235313 Our Website: www.askplc.com Quick details 1)Quality is guarantee within 1 year from the date of
Electronics Forum | Tue Jun 06 13:41:16 EDT 2000 | Charles Harper
I would like to refer you to John W. Kratz, author of Chapter 8, as listed at the top of the forum. John is the outstanding specialist in this subject area.
Electronics Forum | Sat Jun 12 16:24:02 EDT 1999 | JohnW
| Is there public domain information available on standard surface mount package outlines and footprints? | Thanks, | WillyW | Willy, The IPC has a great listing for the std packages and footprints, as do most component manufacturers. I'd start on
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Industry News | 2012-03-28 17:53:21.0
IPC announces the appointment of John W. Mitchell as its new president and CEO,
Parts & Supplies | Assembly Accessories
Part Name： LINK W8×P4 Part No：AWCA3801/AWCA3805/AWCA3806 Pls feel free to contact me if you have any questions about SMT machine and spare parts. Email:john@ksunsmt.com
Parts & Supplies | Assembly Accessories
FUJI NXT Feeder Desc Part Number NXT/XPF 8MM Feeder W08/W08C NXT/XPF 12MM Feeder W12/W12C NXT/XPF 16MM Feeder W16/W16C NXT/XPF 24MM Feeder W24/W24C NXT/XPF 32MM Feeder W32/W32C NXT/XPF 44MM Feeder W44/W44C NXT/XPF 56MM Feeder W56/
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Dinghua Technology --- the biggest manufacturer of BGA/SMD rework machine in the China. We are the supplier for V-tech, Huawei, Sumsung, Lenovo and Foxconn etc.. Contact: John skype: sinobga32
Events Calendar | Tue Aug 29 00:00:00 EDT 2023 - Thu Aug 31 00:00:00 EDT 2023 | Irving, Texas USA
High-Reliability Cleaning and Conformal Coating Conference
Career Center | chennai, India | 2017-04-10 14:51:26.0
Engineering,Maintenance,Production,Research and Development
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1668&OB=DESC.html
. Does anyone understand why this Fairchild is so different from what is typically recommend? What would you follow? https://www.fairchildsemi.com/datasheets/ES/ES1J.pdf Thanks, John W
Baja Bid | https://bajabid.com/category/testimonials/page/4/
Recommendations Testimonials Auctions Buy/Sell Buy Equipment Sell Your Equipment News Contact Testimonials You are here: Home Category "Testimonials" Bud W
