New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
Electronics Forum | Wed Feb 05 19:14:24 EST 2020 | victorzubashev
Hi all, what you can suggest using as an instant and reliable adhesion for jumper/hook up wires with PTFE insulation during SMT rework on FR4 PCBs? Cheers, Victor
Electronics Forum | Wed Feb 05 20:13:13 EST 2020 | sarason
precut wirewrap wires. sarason
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Parts & Supplies | SMT Equipment
Smt Juki_700-2000series_8x4mm_FF-style used in pick and place machine JUKI SMT Mounter feeder / feeder / feeding gun / Feeder / Stick Feeder / Stack Stick Feeder: Part Number Description E3003706AB0 AF12FS JUKI FEEDER 40081758 CF03HPR 8mm TAPE F
Parts & Supplies | Pick and Place/Feeders
Smt JUKI-feeder-NF8mm used in pick and place machine JUKI SMT Mounter feeder / feeder / feeding gun / Feeder / Stick Feeder / Stack Stick Feeder: Part Number Description E3003706AB0 AF12FS JUKI FEEDER 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 06
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2020-02-14 14:43:21.0
To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | Orlando, Florida USA | Production
Position Summary: Build through-hole (THT) and surface mount (SMT) printed circuit board assemblies, placing components on boards per controlled parts lists, drawing documentation and quality workmanship guidelines. Position reports to: Group Lea
Career Center | Cavite, Philippines | Maintenance,Production,Technical Support
SKILLS: Mandarin, English skills Quick Learner, willing to be trained Knowledge in Automatic Insertion and Surface Mount Technology Machine (Industrial machines) Can handle and Troubleshoot Electromechanical machines Can read and
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/j9060014b-sub-conv-jumper-217889?page=2&category=1123
SAMSUNG SUB CONV JUMPER J9060014B | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products SAMSUNG SUB CONV JUMPER Public Pricelist Public Pricelist
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_footprint-for-solderable-jumper_topic2089.xml
. with solder paste over both pads and the gap between the pads for a close jumper after reflowA resistor would be something like "RESC1608X70"Is there any naming convention or recommendations for both footprints
