Industry News: ken si (4)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and On-line Registration Now Open

Industry News | 2009-07-24 14:12:49.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Express Newsletter: ken si (49)

Partner Websites: ken si (65)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

. Perovic Abstract 32-1 Stretchable Polyurethane-Based Conductive Ink for E-Textile Applications Pengxiang Si, Li Chen, Boxin Zhao, Alex Chen, John Persic and Robert Lyn Abstract 32-1 Using Vacuum

Surface Mount Technology Association (SMTA)


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