NF1060-VF is a new addition to Kester’s No-Clean, VOC-Free product line. NF1060-VF is zero-halogen (none intentionally added) wave soldering flux that maintains its soldering performance achieving excellent through-hole fill and low-defect soldering
New Equipment | Solder Materials
NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In additio
Industry News | 2016-09-15 18:08:04.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2014-02-11 18:21:25.0
SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 8-10, 2014 at the Eastin Hotel in Penang, Malaysia.
Technical Library | 1999-05-07 11:24:21.0
Many manufacturers have now completed the conversion to no clean solder paste. Many factors governed this initial conversion, among those being cosmetics, solder ability, and process ability. In circuit testing or probing through no clean solder paste residues has topically not been a major factor in the conversion decision for several reasons. Due to board design, solder paste was only used on one side of the board and not subjected to testing...
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike
| https://www.eptac.com/soldertip/soldertip-38-clean-vs-no-clean-fluxes/
SolderTip #38: Clean vs No-Clean Fluxes - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11927753-kingfei-smt-production-line-automatic-no-clean-lead-free-solder-paste-heater.html
KingFei SMT Production Line Automatic No Clean Lead Free Solder Paste Heater Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
