Electronics Forum | Wed Aug 09 01:58:51 EDT 2006 | tk380514
OK i have a question: I have a prototype BOM and i suggested the customer that we use Paste-in-hole for the 1 connector that they want to use, but its quite high component and not very wide: http://www.molex.com/pdm_docs/sd/022272051_sd.pdf If i u
Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen
Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem
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C-slide , is ideal for all kinds of applications using Anisotropic Conductive Film (ACF) final or heat-seal bonding, hot bar reflow soldering, and heat staking processes to produce LCD, flex foil, and PCB interconnections
