Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
Industry Directory | Manufacturer
Fraser Technologies is the UK market leader in solder paste, wire, flux, PCB component cleaning, aqueous cleaning chemistries and equipment. We represent Koki, Chemours™ and also our own KlensTek.
New Equipment | Solder Materials
Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S
All kinds of ELECTRONICS trading & SMT manufacturing in both HK & China! We are sole agent of USA SMarT Sonic SMT stencil cleaning system in both HK & China! Also we rep Phoenix X Ray inspection in among PCB, PCBA, BGA, IC, SMarT Sonic AOI, Koki SMT
Industry News | 2010-01-22 21:46:55.0
Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Industry News | 2025-02-03 19:40:49.0
KOKI, a global leader in soldering materials and process optimization services, will exhibit at IPC APEX 2025. Located at Booth 2410, the KOKI team will introduce its latest formulation of lead free solder paste, the E14 Series, and provide insight into its vast product offering and analytical services.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
SMTnet Express, May 22, 2025, Subscribers: 26,206, Companies: 12,409, Users: 29,639 █ Electronics Manufacturing Technical Articles How Clean Is Clean? Over the past several years, post-reflow defluxing of circuit assemblies has gained
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/exhibition.cfm
Router Seika Paste Viscometer SmartSplice Shoe Wrapping Machine Solderstar Reflow Profiler Teradyne In-Circuit Test System Test Research 3D Solder Paste Inspection Test Research AOI System TruView™
