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Top 10 Consumer Electronics Companies in the World
Electronics Forum | Sat Apr 04 03:24:41 EDT 2009 | monduran
Our company is in the market to replace the $50 toaster oven we use to reflow boards with something that can actually achieve even temperature and a proper reflow curve. We are a RnD type company and have no need for volumes. Though we have some heav
Electronics Forum | Wed Nov 16 09:33:39 EST 2005 | SuMoTe
I can't help you with most of that, but heres a starting point. "L013: 2nd limit over" means that one of your axis is showing outside operating boundries, as in placement head is too far forward. Make sure all your devices are not pushed out to thie
Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Fri Aug 30 03:59:18 EDT 2013 | spoiltforchoice
For "Production" none of the above or any of this type. These little batch oven are for small labs and prototyping houses, even the best ones have only limited control over the reflow process. None of them are intended for the repeated serial use you
Electronics Forum | Tue Apr 09 15:23:05 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:10 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
