Electronics Forum: labels problems at wash process (7)

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

Warming up solder paste at start of days production

Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN

Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili

Industry News: labels problems at wash process (16)

IDENTCO to Exhibit Label Automation Solutions at SMTConnect

Industry News | 2019-03-25 19:08:11.0

IDENTCO is pleased to announce that it will showcase its electronics identification solutions in Hall 4, booth 160 at the upcoming SMTConnect Expo, scheduled to take place May 7-9 at the Messe in Nuremberg, Germany.

IDENTCO International Corporation

Mega ION® SA Now Available for Testing at KYZEN's Lab

Industry News | 2021-06-23 06:30:58.0

Austin American Technology (AAT) is pleased to announce that it has successfully completed the installation of a Mega ION® SA at KYZEN's Applications Lab in Nashville, TN. The Mega ION SA is the perfect addition to KYZEN's Applications Lab for cleaning test requiring a semi-aqueous process. The Mega ION SA rinses with de-ionized water rather than using a solvent to both wash and rise.

Austin American Technology

Express Newsletter: labels problems at wash process (984)

Breakthrough in Molecular Design

Breakthrough in Molecular Design Featured Article Breakthrough in Molecular Design Could Unleash the Full Speed of the Internet Washington State Magazine Cherie Winner PULLMAN,Wash.- Researchers at Washington State University have created design

Partner Websites: labels problems at wash process (66)

Lubrication Systems: Standard vs. Low Volume Low Pressure

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/072419-lubrication-systems-standard-vs-low-volume-low-pressure

. Low Volume Low Pressure Back to all posts Reduce Safety and Environmental Concerns with a More Consistent Metal Stamping Process By Claude Bergeron Metal stamping requires lubrication to minimize

ASYMTEK Products | Nordson Electronics Solutions

Ask Helena & Leo (3)

| https://www.eptac.com/faqs/ask-helena-leo/page/3

. In theory, parylene deposition will draw off any moisture before the coating process. Currently we bake at 149F for one... Read More Building to IPC-A-610 or J-STD-001 QUESTION Question


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