Full Site - : laboratory equipments (Page 48 of 74)

PD Circuits Participates in a Successful SMTA Chapter Program

Industry News | 2009-10-31 01:44:13.0

HAMPSTEAD, N.H. - October 2009 - P.D. Circuits, Inc., specializing in delivering the highest quality PCBs, technical support, and service to OEM and EMS companies worldwide, announces a successful program hosted by the Empire Chapter of the SMTA.

NCAB Group USA

Henkel Electronics Moves to New State-of-the-Art Headquarters in Irvine, California

Industry News | 2010-08-17 15:04:10.0

Henkel’s Adhesive Electronics business has relocated its headquarters to a new facility in Irvine, California which the company fully expects will help further its innovation initiatives.

Henkel Electronic Materials

Kyzen to Feature Its Award-Winning Cleaning Chemistries at NEPCON West China 2012

Industry News | 2012-06-06 11:24:33.0

Kyzen,announces that it will feature its award-winning LONOX® L5611 stencil cleaning chemistry and AQUANOX® A4703 neutral pH aqueous cleaning chemistry in booth #B06 at the upcoming NEPCON West China 2012 exhibition and conference.

KYZEN Corporation

ACD Acquires a PSA N2-GEN® Series Pressure Swing Adsorption Nitrogen Generator

Industry News | 2012-08-01 17:06:10.0

ACD, recently installed a PSA N2-GEN® Series Pressure Swing Adsorption (PSA) Nitrogen Generator from South-Tek Systems. Dee Claybrook of Southwest Systems Technology, Inc. assisted with the purchase of the system, which will enable ACD to reduce its Nitrogen costs by up to 90 percent

Automated Circuit Design (ACD)

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

Industry News | 2014-05-07 16:25:39.0

Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines.

Engineered Materials Systems, Inc.

Toddco General, Inc. TG-1000 Hot Bar Bonding System for large displays and substrates

Industry News | 2014-08-16 17:55:06.0

Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.

Toddco3

GKG Asia Receives Coveted TÜV SÜD Certification for Its GL Printer

Industry News | 2014-12-02 13:32:31.0

GKG Asia Pte Ltd, a leading supplier of fully automatic vision printers, announces that the GL printer is now TÜV SÜD certified for both the United States and Canada.

GKG Asia Pte Ltd

Datest Signs Representative Agreement with DiversiTech Representatives

Industry News | 2015-05-19 19:27:46.0

Datest today announced that it has appointed DiversiTech Representatives, Inc. as its sales representative. DiversiTech will represent Datest’s advanced, efficient and mission-critical in-circuit testing, test engineering, failure analysis and X-ray inspection solutions throughout Southern California and Northern Baja California.

Datest

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation


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