Industry News | 2024-03-11 17:53:48.0
PVA is proud to announce that it has been honored with a prestigious CIRCUIT ASSEMBLY 2024 NPI (New Product Introduction) Award in the category of Dispensing Equipment for its groundbreaking PathMaster X software. This innovative software, meticulously crafted for PVA's Direct Series Delta line, offers advanced capabilities and a fully customizable platform tailored to production requirements.
Industry News | 2021-11-22 08:24:23.0
Datest is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Test Services for its High Energy CT Service. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.
Industry News | 2004-11-30 14:20:16.0
Linux OS has achieved an exceptional benchmark score of 95.2 in tests against EEMBC's automotive/industrial benchmark suite
Industry News | 2007-11-12 19:36:07.0
Agilent Technologies Inc. (NYSE: A) and Anite plc (LSE: AIE) today announced that they have entered into a strategic partnership to deliver industry-leading 3GPP Long Term Evolution (LTE) test solutions to wireless R&D engineers designing next-generation mobile communications products.
Industry News | 2008-07-19 12:33:16.0
Agilent Technologies Inc. (NYSE: A) today announced the availability of scanning microwave microscopy (SMM) mode, a unique imaging technique that combines the comprehensive electrical measurement capabilities of a performance network analyzer (PNA) with the outstanding spatial resolution of an atomic force microscope (AFM).
Industry News | 2010-03-22 15:00:10.0
SMTA and CALCE at the University of Maryland are pleased to announce a west coast venue for the Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts.
Industry News | 2015-07-01 15:44:06.0
Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
Industry News | 2015-08-20 08:37:19.0
Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility. The SPHERE™ plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
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