Used SMT Equipment | General Purpose Test & Measurement
LitePoint IQnxn WiFi MIMO R&D Test Solution features multiple, synchronized vector signal analysis (VSA) and vector signal generator (VSG) instruments designed to characterize and test the latest MIMO WiFi (802.11n) products. The flexible system al
Used SMT Equipment | In-Circuit Testers
Litepoint IQnxn LitePoint IQnxn WiFi MIMO R&D Test Solution features multiple, synchronized vector signal analysis (VSA) and vector signal generator (VSG) instruments designed to characterize and test the latest MIMO WiFi (802.11n) products. Th
Used SMT Equipment | In-Circuit Testers
Litepoint IQnxn LitePoint IQnxn WiFi MIMO R&D Test Solution features multiple, synchronized vector signal analysis (VSA) and vector signal generator (VSG) instruments designed to characterize and test the latest MIMO WiFi (802.11n) products. Th
Used SMT Equipment | Coating and Encapsulation
2007 Asymtek C740 Conformal Coating Machine, 110VAC and dry shop air required. Inline, L to r Board Flow, SMEMA Last material used: Humiseal 1A33, 1B73, 1B31 Nozzle: SC200HS and a Micro Spray Nozzle. Material Supply Vessel, Operating Manuals and
Used SMT Equipment | THT Equipment
Universal Instruments Corp Axial insertion machine, model 6241B with a 20 Station Sequencer, Standard 2.5/5.0MM tooling, Non-pass through Rotary Table, 20 re-fire component dispense Feeders, J11 controller, one universal adjustable work board holder
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
The temate 2700 has proven capabilities to provide full volumetric, ultrasonic inspection of laser welds in tailor welded blanks, body assembly, drive-shafts, ring gear components, and other automotive parts. The temate 2700 directly inspects final
The temate 2700 has proven capabilities to provide full volumetric, ultrasonic inspection of laser welds in tailor welded blanks, body assembly, drive-shafts, ring gear components, and other automotive parts. The temate 2700 directly inspects final
Tape widths support from 8mm to 56mm carrier tape, K0 Max: 28mm PLC and PID Temperature? Control Parts Lack Detection (Optional) Independently seal temp. control for each cover side Ratchet Wheel and Stepper motor Design
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