General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2003-03-31 09:43:08.0
With Schedectady International to develop, manufacture, and sell waterborne photoimagable etch resists and soldermasks in North America.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Industry News | 2011-02-24 21:39:40.0
The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.
Industry News | 2012-02-07 00:51:20.0
A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.
