Industry News | 2011-08-08 14:36:41.0
Engineered Conductive Materials, LLC will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.
Industry News | 2012-04-13 19:02:54.0
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars
Industry News | 2013-04-25 16:35:51.0
Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.
Industry News | 2013-11-25 19:25:17.0
Indium Corporation's Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Industry News | 2014-09-16 11:29:42.0
Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.
Industry News | 2023-11-27 12:58:35.0
MacDermid Alpha Electronics Solutions introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is MacDermid Alpha's latest liquid flux for the photovoltaic market.
Industry News | 2018-06-04 18:24:29.0
Nordson DIMA, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit a range of products for hot bar soldering, as well as fluid dispensing and coating systems, at SMT Hybrid 2018 in Nuremberg, Germany, June 5-7, 2018, in the AAT Aston GmbH stand, Hall 4, booth 241.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Thu May 06 18:31:29 EDT 2004 | Dreamsniper
"Polymide Films absorb a great deal of moisture. Polymide laminates must be baked at more than 1 hour at 100'C or better for a double sided PWB prior to exposing the laminate to elevated temperatures such as that required for soldering. Moisture abso
Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon
| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de
