Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry News | 2009-08-09 16:21:55.0
Pressure-indicating Sensor Film Improves PCB Yield and Reliability
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Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.
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We laminate, die cut and fabricate pressure sensitive tapes, hook and loop materials (3M , Velcro etc.), fasteners, special adhesive films, bumpers and protective products to customer specs and specialize in resolving unusual applications.
2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit
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The right cable labels for your projects are super important that's why we have the right size cable labels. Printed for free on any laser printer along with free samples. + FREE Software + FREE samples.
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R&D, production and sales of chemicals, equipment and related materials used in the production of PCB
Industry News | 2010-12-03 22:31:01.0
Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
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Electronic Manufactoring Services specialised on transparent conductive Films and on a cold pick & place process.
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