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Budapest University of Technology and Economics

Industry Directory | Research Institute / Laboratory / School

BME is considered the world's oldest Institute of Technology which has university rank and structure. It was the first institute in Europe to train engineers at university level.

Engineered Materials Systems Debuts DF-2000 Series Dry Film Negative Photoresist at IWLPC

Industry News | 2013-10-04 16:50:46.0

Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces DF-3020 Antimony Free Dry Film Negative Photoresist

Industry News | 2013-10-29 13:26:58.0

Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).

Engineered Materials Systems, Inc.

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-04-22 11:52:53.0

Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Engineered Conductive Materials Introduces Fast Cure Conductive Adhesive for Back Contact Solar Modules

Industry News | 2011-08-29 16:29:56.0

Engineered Conductive Materials debuts its DB-1580 Series Conductive Stringer Attach Adhesives for back contact applications in crystalline silicon solar modules.

Engineered Conductive Materials, LLC

SUMMER DISCOUNT FOR PRESSUREX SENSOR FILM OFFERED TO SUPPORT ACADEMIC RESEARCH

Industry News | 2010-07-16 13:28:25.0

Discount on Pressurex Pressure Indicating Sensor Film Offered to Researchers

Sensor Products Inc.

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

Industry News | 2015-03-20 09:51:33.0

THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION

AI Technology, Inc. (AIT)

MacDermid Alpha to Present Next Generation Assembly & Interconect Technologies for 3D In-Mold Electronics at TechBlick 2022

Industry News | 2022-10-04 11:23:40.0

MacDermid Alpha Electronics Solutions will present the technical paper 'Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces' at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.

MacDermid Alpha Electronics Solutions

Christopher Associates Announces Product Lineup for Intersolar NA 2010

Industry News | 2010-06-21 14:39:59.0

Christopher Associates Inc. will be exhibiting at Intersolar North America 2010 in San Francisco’s Moscone Center West Hall from July 13-15, Level 3, booth 9247. The company will display a comprehensive portfolio of new technologies.

Christopher Associates Inc.


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