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Engineered Conductive Materials introduces DB-1588 Low Cost Conductive Adhesive for Back Contact Solar Modules

Industry News | 2011-11-08 13:28:32.0

Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.

Engineered Conductive Materials, LLC

Polyonics Premiers Four New Materials

Industry News | 2009-04-15 16:24:57.0

WESTMORELAND, N.H. � April 2009 �Polyonics introduces four new materials to help win over new and existing projects.

Polyonics, Inc.

Protective Overlays for Flexible Electronics

Industry News | 2010-11-24 16:26:50.0

Selecting a durable substrate for your printed electronics application can be half the required effort. Protecting the printed circuit from harsh environments by encapsulating with a protective overlay may be required. To help provide this protection, Polyonics is offering protective overlays designed to withstand harsh environments.

Polyonics, Inc.

Engineered Conductive Materials to Debut Conductive Adhesives for Back Contact Solar Modules at PVSEC 2011

Industry News | 2011-08-08 14:36:41.0

Engineered Conductive Materials, LLC will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.

Engineered Conductive Materials, LLC

Engineered Conductive Materials Introduces Spot Curing Conductive Adhesive DB-1590

Industry News | 2012-04-13 19:02:54.0

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars

ECM Equipment Sales, Inc.

Engineered Material Systems to Debut Low-Cost Conductive Adhesive for Back Contact Solar Modules at SNEC 2013

Industry News | 2013-04-25 16:35:51.0

Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.

Engineered Materials Systems, Inc.

Indium Corporation Technology Expert to Present at EPTC

Industry News | 2013-11-25 19:25:17.0

Indium Corporation's Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.

Indium Corporation

Engineered Material Systems to Showcase EMS 561-147 Conductive Adhesive for HIT Modules at the EU PVSEC

Industry News | 2014-09-16 11:29:42.0

Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.

Engineered Materials Systems, Inc.

AMWEI PTC Thermistor Heater

AMWEI PTC Thermistor Heater

New Equipment | Components

PTC Heater is ceramic barium titanate PTC thermistor used for self-regulation constant heating, no glowing parts, no overheating, energy efficient, compact design, long service life. PTC thermistor positive R/T characteristic means that electric pow

Amwei Thermistor Sensor

MacDermid Alpha launches ALPHA® SF828-MBB photovoltaic liquid flux for advanced multi-busbar interconnections

Industry News | 2023-11-27 12:58:35.0

MacDermid Alpha Electronics Solutions introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is MacDermid Alpha's latest liquid flux for the photovoltaic market.

MacDermid Alpha Electronics Solutions


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