Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
SMT XTRA is a global electronics specialist, providing productivity enhancing solutions for the global Surface Mount electronic assembly sector.
Industry Directory | Manufacturer
I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Thu Mar 03 09:29:12 EST 2005 | jdengler
This sounds like you are using a straight ramp profile. For this type of an assembly you may need to use a soak type profile. Most solder paste providers show you both types of profiles that work best with that paste. I would try using that profil
Electronics Forum | Thu Mar 03 10:59:37 EST 2005 | Rob
Also try boosting the bottom zones up to get extra heat in. Now try this at lead free temperatures & watch them go pop as the air inside expands & vents at the base. O to be in America & be free of our wonderful european decision makers.
Used SMT Equipment | Soldering - Reflow
TNV25-508EM Feature: · New heat insulation Design with Energy Saving Effect · N2 consumption largely reduced · Air conditioning load also reduced · Power consumption about 40% reduced · N2 consumption abou
Used SMT Equipment | AOI / Automated Optical Inspection
Operating System: Linux Details: • Inspection envelope 20” x 20” • Large format 5mp Color camera for01005 Inspection • Quad Color lighting • Telecentric, Look Down Optics • High speed precision stage with .05um Linear Encoder • System softwar
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Parts & Supplies | SMT Equipment
BEARING CAP(107298) BEARING CAP(107298) if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +8
Parts & Supplies | SMT Equipment
REEL CAP MV/ MSH2 Part Name:REEL CAP MV/ MSH2 Part No:1016133013 (Currenly, our factory have a new batch of SMT spare parts with very good advantage price, if need more info about the products , pls don’t hesitate to contact with us at any tim
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
J9065280A FEEDING SWITCH ASSY(NON IT) J9065176A FEEDING SWITCH ASSY(IT) J7066360A REEL BRAKE LARGE J706
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | Bedford, Texas USA | Sales/Marketing
Sell SMT capital lines in the SE region for a major OEM provider. Candidate needs prior succesful track record selling to major accounts in the SE region and preferring contacts with major accounts there including any large contract manufacturers.
Career Center | Tampa, Florida USA | Production
Help Reptron Electronics be a leader in the Electronics industry by acting as the Process Engineering Technician on 2nd Shift for our Printed Circuit Board Manufacturing Division in Tampa, Florida. Reptron is a large contract manufacturer providing s
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Heller Industries Inc. | https://hellerindustries.com/smt-reflow-ovens/
SMT Reflow Oven For Large PCB Reflow Soldering Home » SMT Reflow Oven For Large PCB Reflow Soldering SMT Reflow Oven – MK5 SMT Reflow Ovens for Large PCB and Dual Lane Soldering The breakthroughs associated with the MK5 SMT reflow oven provide an even lower cost-of-ownership
| http://etasmt.com:9060/te_product_g/2019-08-27/5029.chtml
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