SOS Inventory Software provides top-of-the-line inventory control, order management, and manufacturing for a wide variety of industries, plus integration with QBO, UPS, ShipStation, Shopify, BigCommerce, Zapier and PayPal.
Manufacture of protective packaging materials. Products include corrugated cushioned shipping containers and cushioned pouches in anti-static and shielding options. Also manufacture Suspension packs for larger instruments.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Electronics Forum | Thu Apr 16 13:07:37 EDT 2015 | swiese242
I would like to know good ways to market for production projects. We have updated our two lines, and have almost double our manufacturing capabilities. We have tried Thomas.net and Kelly before and think it is over priced. Have already updated websit
Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum
So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the
Used SMT Equipment | Chipshooters / Chip Mounters
YAMAHA YSM10 PICK AND PLACE MACHINE SPECIFICATION :YSM10 Object base size :L510 x W460 mm ～ L50 x W50 mm ※Optional accessories can correspond to the L610mm substrate Mounting capacity:HM mounting head (10 nozzles) specification /HM5 mount
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Parts & Supplies | Pick and Place/Feeders
- Two new placement head types in an evolution of the “1-head solution” to achieve high productivity: Accommodates super-small 0201 (0.25 x 0.125 mm) size components and large components - Extended detection range of components held for
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Parts & Supplies | Pick and Place/Feeders
40009773 Nozzle 558 juki nozzle ZK Electronic JUKI nozzle models are very complete, and JUKI2000 series nozzles have JUKI500/501/502/503/504/505/506/507/508/509/512/513/514/515/516/517/618/629, etc JUKI Suction Nozzle 500 NOZZLE ASEMBL Y 400110
Technical Library | 2023-08-16 18:13:53.0
In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Los Gatos, California | Management,Sales/Marketing
Seasoned sales professional skilled in both direct sales and sales management. Recognized for polished communication, negotiation, and problem-solving skills, Excelled in positions where a combination of direct sales and channel sales force developm
results for Chips shooters(click for larger version
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_screen_printers_transition.html
. Excellent low volume printer for single or DOUBLE sided PCB. This is the popular semi automatic model, the larger size capable of 29 X 29 STENCILS
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/proportional-throughhole-padstacks_topic90_post41.html
) or the Pad is 20 mil (0.5 mm) larger than the hole size. Then, as the hole size gradually gets larger, the pad annular ring grows "Proportionally" larger in increments of 1 mil (0.025 mm
