Industry News | 2020-09-17 11:45:16.0
The SMTA announced Jeff Doubrava, Managing Partner, Prismark Partners LLC, will keynote the Additive Electronics Conference on October 15, 2020.
Industry News | 2022-09-26 06:29:47.0
XDry Corp. today announced that it received a 2022 Mexico Technology Award in the category of Dry Boxes for its HXD2-1106-01 Heated Dry Cabinet. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2012-03-22 19:12:37.0
The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO® 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology.
Industry News | 2018-12-11 19:12:27.0
Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.
Industry News | 2022-07-25 08:38:11.0
IPC Releases EMS Industry Results for June 2022
Aerotech's A3200 MotionPAC is a software-based Programmable Logic Controller (PLC) that is completely integrated with Aerotech's A3200 motion controller to increase programming efficiency, decrease development time and to increase quality. The Motion
The Automation 3200 multi-axis motion controller is software-based (no PC slots required) and marries a robust, high performance motion engine with vision, PLC, robotics and I/O in one unified programming environment. The A3200 utilizes the industry
Industry Directory | Distributor
WIDA is the sole distributor for a number of world-class manufacturers in the electronics industry like Weller, Stannol, Erem, Xcelite, Wire Wrap and Vision Engineering. www.widaco.net
Events Calendar | Wed Feb 15 16:00:00 EST 2017 - Wed Feb 15 16:30:00 EST 2017 | San Diego, California USA
Invited Speaker at APEX 2017 - Embracing a new Paradigm: Electronic Work Instructions
Technical Library | 2016-09-01 16:21:11.0
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included.
