Industry News | 2008-10-29 17:30:39.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that it recently developed the CK300 - Catalyst Killer.
Industry News | 2011-05-19 21:51:24.0
Christopher Associates introduces Onstatic Technology Corp.’s (OTC) R-500 WH White LPI Solder Mask, designed specifically for LED lighting applications.
Industry News | 2008-10-29 16:47:50.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that Genesis Materials Technology (GMT) has recently dramatically improved the ENIG resistance of Florida CirTech's water-based AQ2000 LPI solder mask. AQ2000 LPI is now able to withstand the harsh chemical conditions found in the ENIG process.
Industry Directory | Manufacturer
PCB Global is a dedicated Prototype Quick Turn High Tech. PCB supplier - Quotes and orders can be processed 24/7/365 - free online quotation visit www.pcbglobal.com
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
Printed Circuit Board Prototypes. PNC Specializes in Quick Turn Prototype PCBs starting at 24 Hour turn times without sacrificing Quality. We have been the Leader of quick turn for 45 Years using the latest Manufacturing processes and equipment. Ou
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
