New Equipment | Fabrication Services
High frequency RF, Microwave Printed Circuit Board Design, FAB PNC can provide you with your High Frequency RF PCB and Microwave PCB needs. Our advanced Technologies have made us a leader in the RF/Microwave PCB industry processing FR4 and Rogers Ma
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Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB Quik Details: Product Name: Solar Panel Rigid PCB Base Material: FR4 Epoxy Resin Bare Board Size: 120mm x155mm Surface Finishing: Leaded HASL PCB Material Flamming rate: 94
New Equipment | Fabrication Services
8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2013-02-04 14:14:48.0
Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo
New Equipment | Fabrication Services
Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
Industry News | 2008-02-04 11:15:15.0
The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
Electronics Forum | Mon Nov 09 16:55:33 EST 1998 | Doug Clement
I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available?
Electronics Forum | Tue Nov 10 12:47:06 EST 1998 | Dave F
| I have a need to dispense a latex masking material using an automated dispensing system. We are presently looking at the I&J750. Does anyone have any experience with this piece of equipment, or have a better solution available? | Doug: Fisnar m
