Electronics Forum | Tue Jan 31 15:52:39 EST 2006 | russ
I have never related Solder mask layout to Black Pad. I don't see how they could be related but.......
Electronics Forum | Wed Dec 11 11:26:25 EST 2019 | SMTA-Norah
Yes, a polite complaint to our board shop later and the next batch didn't have that problem at least. I'm not convinced it's an ENIG issue as there was variability panel to panel in the first place.
Electronics Forum | Fri Jun 10 12:48:55 EDT 2016 | deanm
Kyle,thank you for steering me back on track. For relays and connectors I like Tom's suggestion provided you are allowed to add materials to your assemblies. An instant adhesive or perhaps a chip bonder (used in SMT) may work if the preheat is high e
Electronics Forum | Fri Jan 02 16:52:16 EST 2009 | boardhouse
Hi, From a Manufactures choice - Green is the best due to it is the most commonly used mask color in the industry & cheapest. Kind a like Red paint for Barns. For US shops, most only have one LPI machine and to continually switch from Green to othe
Electronics Forum | Mon Sep 27 08:52:11 EDT 1999 | Brian
| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa
Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris
Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b
Electronics Forum | Wed Nov 14 20:28:24 EST 2001 | davef
Not to worry. Just run the boards through the cleaner. It will remove all the solder balls. The gross filter on your washer will collect all the solder balls. Coo eh? ;-) How to cure SM? Is your mask UV, er thermal? After learning the type, you
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
