Parts & Supplies | Pick and Place/Feeders
1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster wheels (two
Parts & Supplies | Pick and Place/Feeders
1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster wheels (two
Parts & Supplies | Pick and Place/Feeders
627/5000 1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster w
Parts & Supplies | Pick and Place/Feeders
628/5000 1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster w
Parts & Supplies | Pick and Place/Feeders
1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster wheels (two
Parts & Supplies | Pick and Place/Feeders
1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster wheels (two
Parts & Supplies | Pick and Place/Feeders
1. Suitable for SMT workshop Feida lay-out, prepare feeder material in advance, improve production efficiency. 2. Stainless steel welded as a whole, the frame is never deformed. 1. Mainly use 30 * 30 MM stainless steel 2. With four caster wheels (two
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Events Calendar | Wed Jul 13 00:00:00 EDT 2022 - Wed Jul 13 00:00:00 EDT 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.