Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Mon Oct 22 11:58:05 EDT 2012 | pbarton
I agree with Lou. Crepe paper is the way to go, MUCH cheaper and conforms much better to parts and surfaces being masked. Source items that have a rubber based adhesive and you will also avoid the conformal coating solvents leaching the masking adhes
Electronics Forum | Thu Nov 16 09:38:09 EST 2017 | vchauhan
I am curious to know anyone has used Samtec SEMA Solder Charge connector (SEARAY Seriese. I have done manufacturer's recommended solder paste and good reflow profile still the solder is leaching to the lead instead of becoming a solder connection. T
Electronics Forum | Thu May 04 10:35:24 EDT 2000 | Sal
THE TERMINONOLY I USED SEEMS TO BE INCORRECT , I THINK THE TERM I WAS LOOKING FOR IS WICKING . BACK TO THE PROBLEM , ISSUES WITH RESNETS, WHERE THE SOLDER PASTE SEEMS TO BE WICKING AWAY FROM THE TERMINATIONS OF THE COMPONENT TOWARDS THE VIAS WHICH AR
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
Electronics Forum | Wed Oct 15 19:11:40 EDT 2003 | dlkearns1
Can also reduce leaching of certain types of components. Also, dont expect to see a "shiny/bright" joint if running Nitrogen in the relfow unit, you'll see a dull/smokey like joint...if running Air then sure,let SHINE! my 2Cents DaveK
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Tue Aug 30 12:49:59 EDT 2005 | Ted
Slaine, We use a Pd/Ag thickfilm paste. Because of the leaching we had to start using solder pastes that have silver in it. For RoHS, we are using a solder paste with an alloy of Sn95/Ag05. We also have to double print the thickfilm pastes. I h
Electronics Forum | Tue Nov 08 17:06:26 EST 2005 | Erik
A while ago I tried using rubber boots for masking but couldn't get them to work because the coating we use (Humiseal 1B73) is so thin it leaches under the rubber. If you can get them to work with your application more power to ya.
