Industry News | 2016-04-18 11:30:07.0
Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2018-07-24 06:39:59.0
SEHO Systems today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 28-30, 2018 at the Shenzhen Convention & Exhibition Center. The company will showcase the MaxiSelective-HS – the selective soldering system for maximum throughput requirements in Booth 1D10.
Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2018-10-01 20:25:11.0
SEHO Systems today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 in Rosemont, IL. The company will introduce the new StartSelective – the perfect plug-and-produce selective soldering system for those just entering into automated soldering in Booth #423.
Industry News | 2013-06-10 17:12:33.0
SEHO Systems GmbH announces that, together with its partner ATD Electronic, it will exhibit in booth #128 at ENOVA, scheduled to take place June 12-15, 2013 at Parc des Expositions du Kram, Tunis
Industry News | 2014-04-07 19:40:27.0
Microtronic GmbHwill exhibit in Stand 9-430A at the SMT Hybrid Packaging exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2014-04-07 19:41:01.0
Microtronic GmbHwill exhibit in Stand 9-430A at the SMT Hybrid Packaging exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2014-04-07 19:44:29.0
Microtronic GmbHwill exhibit in Stand 9-430A at the SMT Hybrid Packaging exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2015-09-03 15:44:25.0
Microtronic today announced plans to exhibit at the 20th European Microelectronics and Packaging Conference & Exhibition (EMPC), scheduled to take place Sept. 14-16, 2015 in Friedrichshafen, Germany. Company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and Sonix ECHO™ as well as specialty solders from AIM.
Industry News | 2018-06-26 15:05:58.0
Solder materials specialist, Almit, reports continuing interest in its premium products from visitors to the company’s stand at the SMT Hybrid Packaging exhibition in Nuremberg.
