Industry News | 2017-10-17 20:12:01.0
PDR today announced plans to exhibit with its Italian distributor Tecnolab in Hall A2, Booth 459 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Technolab will display PDR’s IR-E3G Gold SMD/BGA Rework Station and IR-TS One Benchtop Thermal Testing System. PDR’s advanced focused IR rework technology is ideal when reworking multiple components on the same PCB. The company’s nozzle-free design offers the immediate configuration of your system for same size and varying size components without having to stop and change air nozzles.
Advance Devices, Inc. offers Smart Tweezers LCR Meter - excellent tool for identification testing of SMD Components.
RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
GoldFish a leading Irish electronic product solutions company, providing customised electronic components, hardware and software design services. We are dedicated to providing components and design services at a competitive price combined with a qual
GoldFish a leading Irish electronic product solutions company, providing customised electronic components, hardware and software design services. We are dedicated to providing components and design services at a competitive price combined with a qual
Industry News | 2012-11-26 14:04:53.0
The IDTechEx report The Market for Gold Inks 2013-2019 is looking to identify and assess the opportunities for a printable nano-gold ink, excluding its use in graphic arts applications (where it could be used for both its graphic arts benefits in addition to being used as a functional component in a circuit, such as printed touch switches, are taken into account). Save 25% online by quoting REP2012.
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
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