Full Site - : leaching gold from component leads (Page 9 of 33)

AIM Metals and Alloys Is Partnered with Conflict-Free Tin Initiative as Part of Global Effort

Industry News | 2012-12-15 07:51:07.0

AIM announces its partnership with the Conflict-Free Tin Initiative, whose goal is to create regulated tin supply chains from the South-Kivu region of the Democratic Republic of Congo.

AIM Solder

Saelig Introduces ST-5S Smart Tweezers™ for On-board L/C/R Measurements and PCB Testing

Industry News | 2020-02-05 12:30:26.0

This intelligent measurement tool is a new type of handheld LCR meter that can quickly test, identify, and measure board-mounted surface-mount and leaded devices without the need to remove them from a circuit board.

Saelig Co. Inc.

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

AIM’s Karl Seelig to Discuss Overcoming Challenges of QFNs at SMTAI 2011

Industry News | 2011-09-28 19:53:50.0

AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.

AIM Solder

RMD Instruments to Discuss How to Improve Supply Chain Reliability with XRF Technology at PCB West 2010

Industry News | 2010-08-27 23:51:07.0

WATERTOWN, MA - Devoted to the development of new radiation detector and systems technology, RMD Instruments Corp. announces that Jack Paster and Steve Glass will present a paper titled "Understanding XRF Technology and its Application to Improve Supply Chain Component Reliability through Counterfeit (Sub-Standard) Verification and Comparative Analysis" at the upcoming PCB West Conference & Exhibition.

RMD Instruments

AIM Announces Enhanced Sales and Support in Indiana and Kentucky

Industry News | 2011-11-01 10:40:46.0

AIM has appointed Electronic Assembly Products (EAP) as its representative in Indiana and Kentucky.

AIM Solder

Tyco Electronics Receives Silver Boeing Performance Excellence Award

Industry News | 2009-03-05 15:09:19.0

HARRISBURG, Pa., March 2 /PRNewswire-FirstCall/ Tyco Electronics Ltd. today announced that it has received a 2008 Boeing Performance Excellence Award. The Boeing Company issues the award annually to recognize suppliers who have achieved superior performance. Tyco Electronics maintained a Silver composite performance rating for each month of the 12-month performance period, from Oct. 1, 2007, to Sept. 30, 2008.

TE Connectivity

New Yorker Electronics Releases Gowanda Electronics' Expanded Broadband Conical Line

Industry News | 2021-02-03 09:05:21.0

New Gowanda Broadband Conical Configurations Designed to Enhance Utility in Electronics Design

New Yorker Electronics

DEK ProFlow ATx Tops Performance and Cost-Efficiency among Enclosed Head Print Systems

Industry News | 2010-04-22 16:26:45.0

DEK's ProFlow® system is arguably the gold-standard for enclosed head printing technology. With nearly a decade of documented process advance under its belt, ProFlow has now evolved to deliver even greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.

ASM Assembly Systems (DEK)


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