New Equipment | Education/Training
This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance
New Equipment | Education/Training
This 3-day, lectured course utilizes the images in the IPC-A-610 inspection document to provide visual accept/reject criteria examples for all three classes of assembly production–in both lead and lead-free. The IPC-A-610, “The Acceptabil
Electronics Forum | Thu Feb 16 12:41:50 EST 2006 | fredericksr
Hey folks, I was interested in any information that you might have on tombstone reduction when using a lead free solder and profile. Thanks for any input that you may have! -Russ #x
Electronics Forum | Fri Feb 17 09:02:21 EST 2006 | russ
proper pad geometries, accurate placement, and good reflow profile. Are you having problems right now?
Used SMT Equipment | Soldering - Reflow
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5
Industry News | 2012-12-12 20:19:27.0
A Workshop or Optional PRO-STD-001 Certification
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Parts & Supplies | Pick and Place/Feeders
DEK - SQUEEGEE KIT LEAD FREE MAGNA PRINT 457mm(2 x holders+2 x blades and 4 x paste deflectors ) ..450058 There are also other DEK parts for you !!!DEK MOTOR 107707 DRIVE BELT^RAIL WIDTH DEK 185938 DRIVE BELT^TABLE LIFT DEK 185934 DEK Q-250D
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Technical Library | 2023-06-14 01:09:26.0
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.
Panasonic NPM D3A Pick and Place Machine Equipment If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Oct 08 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | Boxboro, Massachusetts USA
New England Expo and Technical Forum
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | Coopersburg, Pennsylvania USA | Engineering
Lutron Electronics is the world leader in the design and manufacture of architectural lighting controls and systems. Our company was founded in 1961, with the invention of the world�s first electronic light dimmer. We now have over 18,000 products
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb-free
| https://www.eptac.com/soldertips/rechecking-thermal-profiles/
Rechecking Thermal Profiles | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes Standard’s Expert Training On-Site Training Customized Training Discounts Online Training Training Materials Locations All Locations East Coast Midwest West Coast South Canada Resources Ask Helena & Leo Soldertips ®
Blackfox Training Institute, LLC | https://www.blackfox.com/news-events/should-you-use-lead-or-lead-free-solder/
Should You Use Lead Or Lead-Free Solder? – Blackfox – Premier Training and Certification Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | [gtranslate] Search for: Course Calendar Course Calendar 2023 IPC Certification
