Industry News | 2017-08-30 16:58:11.0
Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.
Industry News | 2015-04-07 15:51:51.0
Vi TECHNOLOGY will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2016-09-23 15:41:59.0
Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
Industry News | 2018-09-18 02:49:24.0
Seoul, South Korea – Koh Young Technology, the pioneer and leader in 3D inspection technology, showed the latest Meister-D for the SiP (System-in-Package) assembly process. This innovative technology was recently highlighted at SEMICON Taiwan in the Taipei Nangang Exhibition Center.
Industry News | 2019-01-16 09:48:30.0
Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2010-04-14 21:28:49.0
Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.
Industry News | 2019-11-07 08:25:05.0
07 November 2019 – Seoul, South Korea – Over the past years Koh Young Technology’s drive to not only satisfy but to exceed our customers’ expectations lead to further innovations and a wider range of product portfolio. For the first time visitors of the Productronica show can experience Koh Young’s newest and full range Product Line. From Front to Backend production Koh Young will show a wide range of not only SPI and AOI, but also Machining Optical Inspection (MOI), Automated Pin and Terminal Inspection (API), and more. Koh Young, the leading 3D measurement-based inspection solutions provider, is delivering also in this year’s Productronica new levels of inspection capabilities.
Industry News | 2015-09-14 18:22:50.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation will exhibit in Booth #606 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Nordson’s team of Test and Inspection experts will demonstrate the XD7600NT Diamond FP X-ray inspection system from Nordson DAGE and FX-940 Automated Optical Inspection (AOI) In-line PCB inspection system from Nordson YESTECH.
Industry News | 2018-01-28 19:23:58.0
CyberOptics® Corporation today announced plans to exhibit in Booth #2409 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center, California. Company representatives will demonstrate the new high-speed SQ3000™3D CMM, an extension of the MRS-enabled SQ3000 platform deemed best-in-class, the new SE3000™ SPI system and QX250i™ double-sided AOI system.
