Used SMT Equipment | Soldering - Wave
Vitronics Wave Soldering Machine Model: Delta 6622C Vintage: 2006 Lead-Free (SN100C) Internal Dual Spray Fluxer (2) Bottom-Side Convection Preheat Zones (1) Bottom-Side Cal Rod Preheat Zone (1) Top-Side IR Preheat Zone Cast Iron Solder Pot Mix of L a
Used SMT Equipment | Soldering - Selective
Make: ACE Model: Kiss 102IL Vintage: 2013 Details: • Windows XP Operating System • Lead Free • Topside Preheater • Drop Jet Fluxer Condition: Complete & Operational Locations & Shipping:&nb
Used SMT Equipment | Soldering - Wave
Speedline Electrovert Vectra 450/F Wave Soldering Machine Make: Speedline Electrovert Model: 450/F Year: 1999 Lead-Free Convection Bottom-Side Preheat (2 Zones) No-Clean Flux Board Grip & L Fingers SW: V3.27 Complete & Operational
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Panasonic MSR Feeder Set up Jig / Feeder Loading Unit Size: L260*W360*H150(MM) G.W: 17KG Can load 3 pieces of feeders
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
Used SMT Equipment | Soldering - Selective
ACE KISS 102IL Selective Soldering Machine Make: ACE / Nordson Model: KISS 102IL Year: 2015 Dual Pot Set up (1) Lead-Free Pot & Pump Assembly (1) Leaded Pot & Pump Assembly In-Line Compatibility Top Side Preheat Drop Jet Flu
Used SMT Equipment | Soldering - Wave
Model: 6622CC Vintage: 2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase
