Industry Directory | Manufacturer
Since 1971, Eagle Electronics Inc. has provided our Customers with the highest quality Printed Circuit Boards at fair and competitive prices.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
http://www.flason-smt.com/product/SMT-Assembly-line-lead-free-reflow-oven-for-solar-street-light-M6.html SMT Assembly line lead free reflow oven for solar street light M6 Name: SMT Reflow Oven Heating zones: 6 Heating method: Hot Air Usage: SM
Used SMT Equipment | THT Equipment
High temperature, lead-free Solder Fountain used for removal and replacement of through-hole components
Used SMT Equipment | Soldering - Wave
Speedline Econopak Gold Lead Free Wave Solder System; February 2005; 2 Bottom Side Preheaters, (2) Top Side Preheaters; Lambda Wave, Chip Wave; External USI Performa Spray Fluxer; 440v, 3 phase;Delivery, Installation and training available
Industry News | 2003-05-28 08:20:13.0
Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
How to Maintain a Reflow Oven Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow ove
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Aug 17 18:30:00 UTC 2020 - Mon Aug 17 18:30:00 UTC 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
SMTnet Express, October 10, 2024, Subscribers: 25,836, Companies: 12,282, Users: 29,256 █ Electronics Manufacturing Technical Articles Brief description of ENIG for Multilayer PCB ENIG (Electroless Nickel/Immersion Gold) is to deposit
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/lead-free-soldering-course/
Lead Free Solder Training by Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
GPD Global | https://www.gpd-global.com/lead-free-solder-paste-dispensing.php
. Leaded Solder Paste Dispensing Compare Solder Paste Dispensing for Leaded vs Lead-free Applications Solder Paste is used to make electrical connection between a PCB and component
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